CHEE MAU
D.U.N.S: 613216814
RIGID PCB
Rigid PCB, as the most commonly used type of circuit board, has thousands of manufacturers in China. Our plants for FR4 PCB manufacturing ranked the 60th among them.
Our rigid PCB plants has two individual comprehensive multi-layer building, one for mass production PCB and one for prototype PCB order.
Please refer to our rigid PCB manufacturing capability as below, for extra information you are welcome to send inquiry to us anytime.
RIGID PCB Production Capability
Mass Production
Prototyping
General
Laminates
CEM-1/CEM-3/CTI>=600
Tg180max/FR4/Halogen free
CEM-1/CEM-3/CTI>=600
Tg180max/FR4/Halogen free/IMS/High frequency
Layers count
2 ~ 20
High speed: 12layers
High Frequency: 6layers
Heavy copper (>=4oz) 6layers
2 ~ 36
High speed: 20layers
High Frequency: 10layers
Heavy copper (>=4oz) 12layers
Max. panel size
630*710mm (double layers)
550*650mm (multi layers)
630*1200mm (double layers)
550*650mm (multi layers)
Finished thickness
Max. ET fixture points
0.4 ~ 3.2mm
General: 160k
Dedicated: 12288
0.2 ~ 6.0mm
General: 160k
Dedicated: 12288
Copper thickness
Min. hole size
Aspect ratio
Min. line width/space
Soldermask Dam
Plug Hole Diameter
Impedance tolerance
Soldermask color
0.5 ~ 5oz
4oz for inner layer
6oz for outer layer
0.15mm
8:1
3/3mil
3mil min.
0.3 ~ 0.55mm (GN)
+/-10%
0.5 ~ 10oz
6oz for inner layer
10oz for outer layer
0.1mm
12:1
2.5/2.5mil (LDI+Vacuum DES)
2mil min.
0.3 ~ 0.60mm (GN)
+/-6%
Surface finishing
OSP / HASL / LF HASL / IAg / ISn
ENIG / Gold Finger
OSP / HASL / LF HASL / IAg / ISn
ENIG / Gold Finger
Special Technology
Since 2012
Since 2013
Since 2014
Since 2015
Since 2017
Since 2018
Since 2020
Press fit / Peelable mask / Carbon ink / Kapton tape
Edge plat / Dual finishing (ENIG+Electrical Gold)
Half holes / Vias in pad / 1+n+1 HDI / Dual finishing (HAL+ENIG)
Resin plug / Dual finishing (HASL+Electrical Gold)
2+N+2 HDI
High frequency double layer
3+N+3 HDI / Embedded copper / Backup / Step board / High frequency multilayers
Dual finishing (OSP+ENIG)
