CHEE MAU
D.U.N.S: 613216814
CERAMIC PCB
At Chee mau, we have front leading manufacturing technology of Ceramic PCB in China. Relying on its high heat conductivity performance and chemical stability at extreme working conditions, Ceramic PCB is getting widely used in industries such as semi-conductors, LED lighting, medical,etc.
We are offering ceramic PCB manufacturing service to global customers at quite competitive pricing, welcome to send any cooperation proposal to us.
Ceramic PCB Production Capability
General
Material
Manufacturing Tech
AL2O3, ALN, Sapphire, High Borosilicate Glass
LAM (Laser Activation Metalization)
DPC (Direct Plate Copper)
DBC (Direct Bonded Copper)
HTCC (High-termperature Co-fired Ceramic)
LTCC (Low-termperature Co-fired Ceramic)
Performance
Copper bonding force
>=20 N/cm2
Heat conductivity
20~27 W/m.k (96%AL2O3)
180~220 W/m.k (ALN)
27~30 W/m.k (Sapphire)
2~5 W/m.k (High borosilicate glass)
Warpage
<=2% mm
Substrate
Regular panel size
120*120mm / 127*127mm / 132*132mm
140*130mm / 190*140mm
Regular panel thickness
0.254mm / 0.381mm / 0.5mm / 0.635mm
0.8mm / 1mm / 1.2mm / 1.5mm / 2mm
Advantages
-
Higher heat conductivity
-
Matching thermal expansivity
-
Metal film layer with lower resistance
-
Good solder-ability with higher temperature
-
Low loss in high frequency condition
-
Can be assembled at high-density condition
-
Anti-cosmic rays, long durable at aerospace application
-
No oxide layer at copper layer
Industry
-
Semi conductor
-
LED Lighting
-
Automotive
-
Solar Energy
-
Power Supply
-
Photoelectric Communication
Drill
Min. drill size
Dia. taper tolerance
Drill skewing tolerance
0.075mm
~+/-10%
~+/-0.02mm
Slot tolerance
Length >=2*width
length +/-0.05mm
width +/-0.025mm
Length <2*width
length +/-0.025mm
width +/-0.010mm
Plating
Copper weight/thickness
H/H, 1/1, 2/2, 3/3, 4/4, 5/5, 6/6, 7/7, 8/8, 9/9, 10/10 oz
Copper surface roughness
<=0.3um
Circuit
Circuit para tolerance
+/-0.045mm
Min. L.W/L.S
0.1/0.1mm
Solder mask
Thickness/trace surface
>=10um
Thickness/trace angle
Thickness/laminate
Coffer solder mask thickness
>=8um
>=15um
70~120um
Solder mask para tolerance
+/-0.045mm
Trace Min. width
Surface copoper 1oz
Surface copoper 2oz
Surface copoper 3oz
Surface copoper 4oz
Min. legend line width
0.075mm
0.1mm
0.15mm
0.175mm
0.15mm
Legend
Min. legend width
>=0.15mm
Legend para tolerance
Min. Legend dia.
Min. Legend gap
>=0.15mm
>=0.75mm
>=0.15mm
Surface Finishing
ENIG thickness
0.025~0.075um
Nickel thickness
Immersion silver thickness
4~8um
0.2~0.5um
Immersion tin thickness
0.5~1.5um
OSP thickness
0.2~0.5um
Laser profile
Min. gap between circuit to profile
0.2mm
Cutting line para tolerance
+/-0.02mm
Left thickness
Migration precision tolerance
+/-0.05mm
+/-0.025mm
Cutting line gap
+/-0.025mm
Profile tolerance
Cutting line width
+/-0.1mm
+/-0.1mm
OUR CERAMIC PCBS
